Silicon nitride is an inorganic substance with the chemical formula Si3N4. It is an important structural ceramic material with high hardness, inherent lubricity, and wear resistance. It is an atomic crystal; it is resistant to oxidation at high temperatures. Moreover, it can resist the impact of cold and heat. It will not be broken if it is heated to above 1000°C in the air, cooled rapidly and then heated rapidly. It is precisely because of the excellent characteristics of silicon nitride ceramic that people often use it to manufacture mechanical components such as bearings, turbine blades, mechanical seal rings, permanent molds, and so on. If silicon nitride ceramics, which are resistant to high temperatures and difficult to transfer heat, are used to make the heating surfaces of engine components, not only can the quality of the engine be improved, fuel savings, and thermal efficiency can be improved.
Semiconductors are developing in the direction of high-power, high-frequency, and integration. Semiconductor devices are widely used in wind power generation, solar photovoltaic power generation, electric vehicles, LED lighting and other fields. As electronic components, ceramic substrates play a very important role in the field of LED lighting heat dissipation.
Semiconductor packaging materials are substrates that carry electronic components and their interconnections, and have good electrical insulation. The substrate material should have the following properties: good insulation and resistance to electrical breakdown; high thermal conductivity: direct thermal conductivity Affects the operating conditions and service life of semiconductors, and the uneven temperature field distribution caused by poor heat dissipation will also greatly increase the noise of electronic devices; the thermal expansion coefficient matches other materials used in the package; good high-frequency characteristics: low dielectric Constant and low dielectric loss; smooth surface and uniform thickness: it is convenient to print the circuit on the surface of the substrate and ensure the uniform thickness of the printed circuit.
Currently commonly used substrate materials include: ceramic substrates, glass ceramic substrates, diamond, resin substrates, silicon substrates, and metal or metal composite materials. Among them, ceramics have attracted attention because of their good insulation, stable chemical properties, high thermal conductivity, and good high-frequency characteristics.
TRUNNANO (aka. Luoyang Tongrun Nano Technology Co. Ltd.) is a trusted global chemical material supplier & manufacturer with over 12 years’ experience in providing super high quality chemicals and Nano materials. The Si3N4 powder produced by our company has high purity, fine particle size and impurity content. Lower, please contact us if necessary.
