Spherical quartz powder has excellent properties such as a smooth surface, large specific surface area, high hardness, and stable chemical properties:
The spherical powder fluidity is good, and the resin is stirred into a film evenly. The resin addition amount is small, the filling amount of quartz powder is high, and the mass fraction is up to 90.5%. The higher the filling amount of quartz powder, the lower the thermal conductivity, the smaller the thermal expansion coefficient of plastic sealing material, and the closer to the thermal expansion coefficient of monocrystalline silicon, the better the performance of the electronic components produced.
The stress of the spherical powder is only 60% of that of the angular powder, and the plastic sealing material made from the spherical quartz powder has the lowest stress concentration and strength.
The surface of the spherical powder is smooth, the friction coefficient is small, the wear of the mold is small, and the mold's service life can be extended more than once.
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Performance of Spherical quartz powder Spherical SiO2:
1. High sphericity uniform size can be added to a large extent. The viscosity of the polymer system does not change significantly;
2. The surface of spherical silicon oxide has good fluidity, uniform film formation by stirring with resin, a small amount of resin added, good fluidity, and a high powder filling amount. The smaller the thermal expansion coefficient and the lower the thermal conductivity, the closer it is to the thermal expansion coefficient of single crystal silicon, and the better the performance of the electronic components produced from that place;
3. When the spherical silicon oxide-filled plastic encapsulates the integrated circuit chip, the yield is high, the friction coefficient of the spherical silicon oxide powder is small, and the wear of the mold is small so that the service life of the mold is long. Compared with the angle powder, the mold can be improved. Double the service life;
Specification of Spherical quartz powder Spherical SiO2:
Catalogue | ||||||
Spherical silica | No. | Brand | Particle size | Package | ||
D50,μm | D100,μm | |||||
1 | TR-SS1005 | 0.3 | ≤1.0 | 8kg/bag | ||
2 | TR-SS1035I | 3.5 | / | 20kg/bag | ||
3 | TR-SS1040G | 4.5 | / | 20kg/bag | ||
4 | TR-SS1120D | 12 | / | 20kg/bag | ||
5 | TR-SS1175D | 25 | / | 25k/bag | ||
6 | TR-SS1300D | 30 | / | 25kg/bag | ||
7 | TR-SS1450D | 40 | / | 25kg/bag | ||
8 | TR-SS1560 | 60 | / | 25kg/bag | ||
9 | TR-SS1800A | 80 | / | 25kg/bag |
Test Items | Unit | Typical value | Test Method | |
Chemical Composition | SiOB2B | % | 99.9 | Weight Method |
FeB2BOB3B | ppm | 105 | Spectrophotometer | |
Moisture | % | 0.08 | Weight Method | |
Whiteness | % | 94.5 | Whiteness Meter | |
Extraction Water | Ec | μS/cm | 13.0 | Conductivity Meter |
Na+ | ppm | 0.7 | Atomic Absorption Spectrometer | |
Cl- | ppm | 0.4 | Auto Electric Potential Titrator | |
pH | / | 4.2 | PH Meter |
Chemical vapor deposition technique: Chemical vapor deposition (CVD) is used extensively to prepare spherical silicon. The principle of this method is to mix silicon source gas (such as silicon tetrachloride, silane, etc.) and hydrogen gas and heat to high temperature so that silicon atoms in the reaction chamber to vaporize and form silica particles. The size and morphology of spherical silicon can be altered by controlling the flow rate and the reaction temperature between silicon and hydrogen source gas. The resulting silica particles continuously collide and condense in the reaction chamber, forming spherical silica particles. Multiple deposition and heat treatment processes are required to obtain high-purity and high-density spherical silica.
Combustion method: Combustion is another common method for preparing spherical silica. The principle of this method is to mix the silicon source (such as silicon powder, sodium silicate, etc.) with the fuel (such as gasoline, kerosene, etc.) and heat it to high temperature so that the silicon source burns and releases a large amount of silica gas. The silica gas rapidly cools during combustion and condenses into spherical silica particles. The particle size and morphology of spherical silica can be adjusted by controlling the combustion temperature and atmosphere. Several washing and heat treatment processes are required to obtain high-purity spherical silica.
Ion exchange method: Ion exchange method is a method for preparing high-purity spherical silica. The principle of the method is to use the ion exchanger to carry out the ion exchange reaction with the solution containing silicon ions. The silicon ions are precipitated in silicon dioxide through filtration, washing, drying, and other processes to obtain spherical silicon dioxide products. Commonly used ion exchangers include zeolite, activated carbon, and so on. The particle size and morphology of spherical silica can be adjusted by controlling the type and dosage of the ion exchanger.
In addition, spherical silica prepared by different methods may also differ in performance and application. For example, the spherical silica prepared by chemical vapor deposition has higher purity but smaller particle size; The spherical silica prepared by combustion method has larger particle size but lower purity. Therefore, in practical applications, it is necessary to select suitable spherical silica preparation methods and performance characteristics according to specific needs and actual conditions.
Spherical quartz powder Spherical SiO2 Properties |
|
Other Names | Fused quartz, spherial quartz, spherical SiO2, silica |
CAS No. | 7631-86-9 |
Compound Formula | SiO2 |
Molecular Weight | 60.09 |
Appearance | White Powder |
Melting Point | 1,600° C (2,912° F) |
Solubility in water | N/A |
Density | 2533 kg/m3 |
Purity | 99.5-99.9% |
Particle Size | 10-30nm |
Boling point | 2,230° C (4,046° F) |
Specific Heat | N/A |
Thermal Conductivity | N/A |
Thermal Expansion | N/A |
Young's Modulus | N/A |
Exact Mass | 59.9668 g/mol |
Monoisotopic Mass | 59.967 Da |
Spherical quartz powder Spherical SiO2 Health & Safety Information |
|
Safety Warning | Danger |
Hazard Statements | N/A |
Flashing point | Not applicable |
Hazard Codes | N/A |
Risk Codes | N/A |
Safety Statements | N/A |
RTECS Number | N/A |
Transport Information | NONH |
WGK Germany | NONH |