Photoresist Coated Wafer Product Introduction
This semiconductor-grade photoresist coated wafer is designed for precision photolithography processes in microelectronics manufacturing. Available in standard sizes of 6 inch and 8 inch, with customizable options to meet specific process requirements, the wafer features a high-resolution light-sensitive coating suitable for both positive and negative lithography applications. The uniform photoresist layer ensures excellent patterning performance and reliability across various exposure systems.
Photoresist coated wafer
Features of Photoresist Coated Wafer
Specifications of Photoresist Coated Wafer
| Parameter | Specification / Description |
| Wafer Material | Silicon (Si), <100> or <111> (others available upon request) |
| Wafer Diameter | 6 inch (150 mm), 8 inch (200 mm); customizable sizes available |
| Wafer Thickness | Standard: 675 μm (6") / 725 μm (8"), customizable |
| Resist Type | Positive or Negative photoresist (e.g. AZ series, SU-8, PMMA, etc.) – customizable |
| Coating Thickness | From sub-micron to several microns (customizable per process needs) |
| Coating Method | Spin coating, dip coating or spray coating – depending on resist type and thickness requirement |
| Surface Quality | Uniform coating with minimal defects; high adhesion to substrate |
| Exposure Compatibility | UV lithography, Deep UV (DUV), Electron Beam (E-Beam), I-Line, G-Line |
| Resist Sensitivity | Varies by resist type (e.g., 100 mJ/cm² ~ 300 mJ/cm² for standard positive resists) |
| Resolution | Up to sub-micron level (depends on exposure system and resist type) |
| Patterning Capability | Fine line/space features down to 0.5 μm or better (process-dependent) |
| Storage Conditions | Store in clean, dry environment; avoid light exposure and moisture |
| Packaging | Inert gas sealed packaging; cassette or FOUP available |
Packing and Storage
The product is in powder form and should be stored in a cool, ventilated place. Avoid inhalation when using it and keep away from open flames, heat sources, etc.
Packing and Storage
Company Profile
Luoyang Tongrun Nano Technology Co. Ltd. (TRUNNANO) is a trusted global chemical material supplier & manufacturer with over 12-year-experience in providing super high-quality chemicals and nanomaterials, including boride powder, nitride powder, graphite powder, sulfide powder, 3D printing powder, etc.
The company has a professional technical department and Quality Supervision Department, a well-equipped laboratory, and equipped with advanced testing equipment and after-sales customer service center.
If you are looking for high-quality photoresist film please feel free to contact us or click on the needed products to send an inquiry.
Company Profile
PaymentTerm
T/T, Western Union, Paypal, Credit Card etc.
ShipmentTerm
By air, by sea, by express, as customers request.
FAQs of Photoresist Coated Wafer
Q1: What is photoresist?
A1: It's a light-sensitive "paint" put on a silicon wafer. Light shines through a patterned mask to change parts of it, so a circuit design can be printed onto the chip.
Q2: What are positive and negative photoresist?
A2: In positive resist, the light-exposed parts wash away. In negative resist, the light-exposed parts stay, and the unexposed parts wash away.
Q3: What are the main steps for photoresist on a wafer?
A3: 1. Coat (spin the liquid resist onto the wafer). 2. Bake (dry and harden it). 3. Expose (shine light through a mask). 4. Develop (use a chemical to wash off the pattern).
Q4: Why is the resist thickness important?
A4: If it's not even or the right thickness, the light won't expose it correctly. This makes the printed circuit lines too wide, too narrow, or broken.
Q5: What are common photoresist problems?
A5: The pattern can peel off if adhesion is bad, tiny lines can collapse after washing, or unwanted resist "scum" can be left behind. These cause defects in the chip.
