Overview of Spherical Quartz Powder Spherical quartz SiO2 powder balls are purified and ultra-finely crushed from natural quartz stone,and undergo a certain high temperature field to make their phase,crystal and shape change from solid to molten and then from solid to crystal(from crystallization to crystallization) instantaneously. A powder,from irregular angular particles to regular spherical particles.At present,its preparation methods usually include high temperature plasma melting method, high temperature melting spray method and gas combustion flame method.
What is the applications of Spherical Quartz Powder Spherical quartz SiO2 powder is mainly used for high-temperature vulcanized silicone rubber,silicone defoamers, pre-printed inks,powder coatings, PVC resins, thickeners for unsaturated polyester resins, thixotropic agents,pharmaceutical powders,molding preparations, cosmetics, etc.Spherical quartz SiO2 powder has a wide range of applications, and its use as an electronic packaging material is its largest application market. Electronic packaging is a supporting industry for integrated circuits. With the development of large-scale and very large-scale integrated circuits,integrated circuits have become more and more complex, and the requirements for packaging materials have become higher and higher,and packaging forms are constantly optimized and updated. The three main materials of electronic packaging are substrate material,plastic packaging material,lead frame and solder. Due to the advantages of low cost,simple technology and suitable for mass production of plastic packaging,since its establishment,plastic packaging has developed rapidly, and its share of packaging has become larger and larger. Now, plastic packaging accounts for 95% of the global integrated circuit market. Among plastic packaging materials, epoxy plastic packaging material(EMC) is the mainstream of integrated circuit packaging at home and abroad, and more than 95% of microelectronic components use epoxy plastic packaging.In microelectronic packaging,it is mainly required to have high moisture resistance,low stress, low alpha radiation,resistance to dip soldering and reflow soldering, and good plastic packaging performance after integrated circuit packaging. In this regard, the epoxy resin molding compound must incorporate inorganic fillers in the resin matrix. Almost all inorganic fillers currently in use are fine quartz powder(fine silica powder).With the rapid development of the microelectronics industry, the requirements for packaging materials for large-scale and very large-scale integrated circuits are getting higher and higher. As an important support material for EMC, quartz powder not only requires its particle size to meet a specific packaging range,but also requires its high purity and low content of radioactive elements, especially for particle shape requirements. The main supplier ofSpherical Quartz Powder Luoyang Trunnano Tech Co., Ltd (TRUNNANO) is a professionaloxide powdersupplier with over 12 years of experience in chemical products research and development. We accept payment via Credit Card, T/T, West Union, and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea. If you are looking for high-quality boron carbide powder, please feel free to contact usand send an inquiry.
