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Aluminum nitride ceramic substrate will help China's sensor market

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Update time : 2021-05-21 15:53:30
What is a sensor?
The sensor is a detection device composed of a sensitive element and a conversion element, which can feel the measurement, and can convert the detected and sensed information into an electrical signal (voltage, current, frequency or phase, etc.) according to a certain rule Output, and finally provide a data source for data analysis and artificial intelligence applications of the Internet of Things. High-temperature resistant aluminum nitride ceramic metalized substrate
The high-temperature resistant aluminum nitride ceramic substrate is a high thermal conductivity aluminum nitride ceramic substrate with high thermal conductivity. Generally, metallization is done by copper plating, gold plating, copper plating, and immersion gold.
National Standard for Metallization of Aluminum Nitride Ceramic Substrate
The metallization of aluminum nitride ceramic substrates is done in accordance with customer requirements and existing process capabilities. There is no definite national standard without money. Generally, it is the conventional metallization thickness, and there is no problem as long as it can be made.
The gold plating on aluminum nitride ceramic substrate: generally less than 1 micron, the cost of gold plating is generally low for immersion gold.
Immersion gold on aluminum nitride ceramic substrate: Generally, if the thickness of gold is more than 2 microns, gold is immersed.
Aluminum nitride ceramic substrate coating thickness and current: the thicker the thickness, the stronger the current carrying capacity, the better the new grade, and the better the welding.

Aluminum nitride ceramic substrate metallization process
There are DPC copper plating process, DBC copper-clad process, low-temperature sintering metallization process and high-temperature sintering metallization process, and AMB magnetron sputtering process. DPC aluminum nitride ceramic substrates are more suitable for precision, miniaturization, and integrated ceramic circuit boards. The production cost of DBC is relatively low, can be mass-produced, and is widely used in many fields. It can be used not only for copper plating but also for copper coating. Jin Ruixin can also do gold-tin alloy and platinum. For more questions about the metallization of aluminum nitride ceramic substrates, please consult Jin Ruixin Special Circuits.
Ceramic substrate refers to a special process board in which copper foil is directly bonded to the surface of a ceramic substrate (single-sided or double-sided) at high temperatures. Aluminum nitride ceramic substrate is a substrate made of aluminum nitride ceramics as the main raw material. As a new type of ceramic substrate, aluminum nitride ceramic substrate has the characteristics of high thermal conductivity, good mechanical properties, corrosion resistance, excellent electrical performance, and solderability. It is an ideal large-scale integrated circuit heat dissipation substrate and packaging material. In recent years, with the rapid development of my country's electronic information industry, the market has continuously improved the performance requirements of ceramic substrates. With their excellent characteristics, aluminum nitride ceramic substrates have continuously expanded their application range.

The price of aluminum nitride powder
TRUNNANO (aka. Luoyang Tongrun Nano Technology Co. Ltd.) is a trusted global chemical material supplier & manufacturer with over 12 years of experience in providing super high-quality chemicals and Nanomaterials. Currently, our company has successfully developed a series of powder materials. OEM service is available. If you are looking for aluminum nitride powder, please contact us. Or click on the needed products to send us an inquiry.
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