Study on nano aluminum nitride in thermal conductive plastics
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Update time : 2022-02-18 11:58:38
What is aluminum nitride?
Aluminum nitride AIN crystal has a wurtzite type structure and belongs to hexagonal system with a tetrahedral covalent bond compound. Chemical composition AI 65.81%, N 34.19%, specific gravity 3.261g/cm3, white or grayish white, single crystal colorless transparent, sublimation decomposition temperature is 2450℃ under atmospheric pressure. It is a kind of high temperature and heat resistant material. Aluminum nitride is resistant to molten aluminum, other molten metals and gallium arsenide, especially to molten aluminum.
Performance index of aluminum nitride
(1) High thermal conductivity (about 320W/m·K), close to BeO and SiC, is more than 5 times of Al2O3;
(2) the thermal expansion coefficient (4.5 x 10-6 ℃) and Si (3.5 4 x 10-6 ℃) and GaAs (6 x 10-6 ℃) matching;
(3) various electrical properties (dielectric constant, dielectric loss, body resistivity, dielectric strength) excellent;
(4) Good mechanical properties, the flexural strength is higher than Al2O3 and BeO ceramics, can be atmospheric sintering;
(5) Good optical transmission characteristics;
(6) non-toxic.
Application of nano aluminum nitride in thermal conductive plastics
1, thermal conductive silica gel and thermal conductive epoxy resin:
Ultra high thermal conductivity nano AlN composite silica gel has good thermal conductivity, good electrical insulation, wide electrical insulation temperature (operating temperature -60℃- 200℃), low consistency and good construction performance. Products have reached or exceeded imported products, because can replace similar imported products and widely used in electronic devices heat transfer medium, improve work efficiency. Such as CPU and radiator filling gap, high power transistor, silicon controlled components, diodes, and the substrate in contact with the thin seam heat transfer medium. Nano thermal paste is to fill the gap between IC or audion and heat sink, increase the contact area between them, to achieve better heat dissipation effect.
2, the application of thermal conductive plastics:
Nano aluminum nitride powders can greatly improve the thermal conductivity of plastics. The thermal conductivity of the plastic can be increased from 0.3 to 5 by adding the experimental product to the plastic at a ratio of 5-10%. Thermal conductivity increased by more than 16 times. Compared with the thermal conductivity filler on the market at present, it has the characteristics of low addition amount, improving the mechanical properties of products, and improving the thermal conductivity effect more obviously. At present, relevant application manufacturers have purchased nano aluminum nitride powders on a large scale, and new nano thermal conductive plastics will be put on the market.
3. Other application areas:
Nano aluminum nitride is applied in smelting non-ferrous metal and semiconductor gallium arsenide crucible, evaporation boat, thermocouple protection tube, heat insulation, microwave dielectric materials, high temperature resistant and corrosion resistant structural ceramics and transparent aluminum nitride microwave ceramic products, and the current application and PI resin, thermal insulating mica tape, thermal grease, insulating paint, and heat conduction oil, etc.
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