3. Deposition parameter optimization
3.1 Optimization strategy of temperature, gas flow rate, and target voltage
In the titanium nitride magnetron sputtering process, the optimization of deposition parameters is the key to ensuring the quality of the film. Temperature, gas flow rate, and target voltage are the main factors affecting the performance of the film.
Control of substrate temperature: The substrate temperature directly affects the crystallinity and internal stress of the film.
Higher substrate temperature can enhance the surface diffusion ability of atoms, help form larger grains and denser structures, and reduce residual stress inside the film. However, too high a temperature may cause substrate deformation or film peeling, so a suitable temperature window needs to be found in the process, usually between 300°C and 500°C.
Precise control of gas flow rate: Control of nitrogen flow rate has a direct impact on the stoichiometric ratio and structural uniformity of the film. Too low a nitrogen flow rate will result in insufficient nitrogen content in the TiN film, while too high a nitrogen flow rate will result in nitrogen supersaturation and increased film stress. Therefore, the optimal nitrogen flow rate can be determined experimentally to ensure the high quality of the TiN film.
Adjustment of target voltage: The target voltage mainly affects the energy of sputtered ions and the deposition rate of the film. A higher target voltage will increase the energy of sputtered particles and promote the densification and crystallinity of the film, but it may also increase internal stress and cause the mechanical properties of the film to deteriorate. The optimization of target voltage requires finding a balance between film quality and equipment stability, usually between 300V and 600V.
Titanium Nitride Structure
3.2 Multilayer film design and stress management
In order to further improve the performance of TiN films, especially in stress management, multilayer film structure design has become an effective strategy. By alternately depositing thin film layers of TiN and other materials, the overall stress of the film can be effectively reduced, and its durability and stability can be improved.
Design of multilayer structure: Introducing other materials (such as AlN, Si3N4, etc.) into TiN film to form a multilayer structure can significantly improve the mechanical properties and chemical stability of the film. This multilayer structure is usually achieved through the physical vapor deposition (PVD) process, and the thickness and order of different material layers need to be optimized according to the specific application.
Stress management strategy: The multilayer structure can also offset the stress inside the film by introducing an alternating structure of compressive stress layer and tensile stress layer. For example, by inserting the AlN layer into TiN film, the stress concentration phenomenon of TiN can be effectively alleviated, and the adhesion and crack resistance of the film can be improved. This design can extend the service life of the film in a high-stress environment.
By optimizing deposition parameters and designing a multilayer structure, the comprehensive performance of TiN film can be significantly improved, making it more reliable and durable in practical applications.
4. Film quality and uniformity control
4.1 Film thickness, surface roughness, and grain size control technology
In the magnetron sputtering process, precise control of film thickness is crucial to the functional performance of the film. By adjusting the sputtering time and target current, precise control of film thickness can be achieved. In practical applications, uniform film thickness is the basis for ensuring consistent product performance.
Film thickness control: The control of film thickness is usually achieved by precisely adjusting the sputtering time and target current. In mass production, in order to ensure the consistency of film thickness on large-area substrates, a rotating substrate holder or a multi-target head design is usually required to ensure that the sputtered particles evenly cover the substrate surface.
Surface roughness control: The surface roughness of the film has an important influence on its friction and optical properties. By optimizing the sputtering power and gas flow rate, the particle attachment and defects on the film surface can be reduced, thereby reducing the roughness. In addition, substrate pretreatment (such as plasma cleaning) can also help improve the surface finish of the film.
Grain size control: The grain size directly affects the mechanical and electrical properties of the film. By adjusting the substrate temperature and sputtering power, the growth rate and final size of the grains can be controlled. Higher substrate temperatures generally result in larger grain sizes, while lower temperatures may form finer grain structures, which need to be adjusted according to application requirements.
TRUNNANO Titanium Nitride
4.2 Characterization and improvement measures of film uniformity
The uniformity of the film is one of the important indicators to measure the quality of the sputtering process. In actual production, the uniformity of the film can be significantly improved by accurately controlling the process parameters and equipment configuration.
Uniformity characterization: The characterization of film uniformity is usually carried out by technologies such as X-ray reflectivity (XRR) and ellipsometer. These technologies can provide an accurate distribution map of the film thickness, thereby helping to identify uniformity problems.
Improvement measures: In terms of equipment design, the uniformity of the film can be improved by increasing the substrate rotation speed, adopting a multi-target head design, and optimizing the magnetic field distribution. In addition, adjusting the gas flow distribution and optimizing the sputtering power distribution can also further improve the uniformity of the film. In large-scale production, the process parameters can be monitored and adjusted in real-time through the automated control system to ensure that the uniformity of the film meets the expected standards.
By optimizing the film thickness, surface roughness, grain size, and uniformity control, the quality of TiN films can be comprehensively improved so that they can show excellent performance and reliability in various applications.
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