Description of Aluminum silicon carbide Al/SiC
Aluminum silicon carbide (Al SiC) is a metal-based thermal management composite composed of aluminum and silicon carbide, which is a special packaging material for electronic components. It mainly refers to the combination of aluminum and high volume fraction silicon carbide into a packaging material with low density, high thermal conductivity and low expansion coefficient, in order to solve the thermal failure of electronic circuits.
Performance parameters of Aluminum Matrix Composites
|
Materials |
Density g/cm3 |
Modulus of elasticity GPa |
Strength MPa |
Coefficient of expansion 10-6 beat K |
Thermal conductivity W / m ·K |
|
|
SiC/Al |
15vol%SiC/Al |
2.82 |
100±5 |
560 |
17.0±1 |
150±5 |
|
20vol%SiC/Al |
2.85 |
110±5 |
580 |
16.0±1 |
160±5 |
|
|
25vol%SiC/Al |
2.86 |
115±5 |
600 |
14.3±1 |
170±5 |
|
|
30vol%SiC/Al |
2.89 |
125±5 |
560 |
13.1±1 |
175±5 |
|
|
45vol%SiC/Al |
2.92 |
160±5 |
500 |
11.5±1 |
190±5 |
|
|
55vol%SiC/Al |
2.95 |
195±5 |
450 |
9.5±1 |
200±5 |
|
|
60vol%SiC/Al |
2.98 |
200±5 |
420 |
8.3±1 |
205±5 |
|
|
65vol%SiC/Al |
3.01 |
215±5 |
400 |
7.5±1 |
210±5 |
|
|
70vol%SiC/Al |
3.02 |
220±5 |
380 |
7.0±1 |
215±5 |
|
Characteristics of Aluminum Silicon Carbide Al/SiC
Silicon carbide aluminum SiC/ Al matrix composites have many outstanding advantages, such as low density, high specific stiffness, low thermal expansion coefficient, high thermal conductivity and so on, which are very suitable for high stability optomechanical systems.
For example: (1) high structural stability (static stiffness, dynamic stiffness): the elastic modulus is 2 times that of titanium alloy, 3 times that of aluminum alloy, and the specific stiffness is 3 times that of aluminum alloy and titanium alloy; (2) high thermal control stability: the coefficient of thermal expansion can be 20% lower than that of titanium alloy, and the thermal conductivity is 30 times that of titanium alloy.
Applications of Aluminum Silicon Carbide Al/SiC
Al/SiC can meet the development needs of semiconductor chip integration along Moore's law, which leads to a sharp increase in chip calorific value, a decrease in service life and the "light and thin" development of electronic packaging.
Especially in aerospace, microwave integrated circuits, power modules, military RF system chips and other packaging analysis is very prominent, which has become an important trend in the application and development of packaging materials.
Packing & Shipping of Aluminum Silicon Carbide Al/SiC :
We have many different kinds of packing which depend on Aluminum Silicon Carbide Al/SiC quantity.
Aluminum Silicon Carbide Al/SiC shipping: could be shipped out by sea, by air, by express as soon as possible once payment receipt.
