What are the new requirements for micro silica powder by the rapid development of large-scale integrated circuits?
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Update time : 2023-09-08 08:53:26
What is micro silica powder?
As a typical inorganic filler, micro silica powder has many excellent characteristics: high insulation, high thermal conductivity, high thermal stability, low thermal expansion coefficient, low dielectric constant, low raw material cost, acid and alkali resistance, wear resistance, and so on. It can be used in many fields, such as copper-clad laminate, epoxy plastic sealing material, rubber, plastic, coating, electrical insulation, etc. Copper-clad laminate
With the growth of the global 5G market and the trend of miniaturization and multi-function electronic products, printed circuit boards must be lightweight, highly integrated, and highly functional. Copper-clad laminate, as a raw material for printed circuit boards, is also facing more Stringent requirements
For copper-clad laminate, it is necessary to have high glass transition temperature, high modulus and low thermal expansion coefficient, low dielectric constant and dielectric loss to improve the reliability of electronic circuit interconnection and installation and to meet the requirements of high-frequency and high-speed signal transmission.
Fused micro silica powder and spherical micro silica powder show good properties such as dielectric loss, dielectric constant, and linear expansion coefficient, which match the technical requirements of high-frequency and high-speed copper clad laminates and are the key functional fillers of high-frequency and high-speed copper clad laminates for 5G communication.
Applying high-frequency and high-speed copper-clad laminate drives the demand for high-end micro silica powder. The domestic demand for micro silica powder for copper-clad laminate is expected to reach 0.5 billion USD in 2025, of which the market scale of micro silica powder for high-frequency substrate CCL is expected to reach 1.11 billion yuan. Epoxy plastic sealing material
Epoxy plastic sealing material is widely used in the packaging of semiconductor devices. With the miniaturization and high integration of components, the power density of electronic devices increases sharply, and the heat generated by the device needs to be effectively removed to improve the life and reliability of the devices.
This also puts forward higher requirements for the performance of epoxy plastic sealing materials, which require better dielectric properties and more stringent requirements for heat resistance, cold resistance, moisture resistance, and heat dissipation of products.
micro silica micro-powder is an important filler in high-end epoxy plastic sealing materials. As the largest component in epoxy plastic sealing materials, micro silica micro-powder accounts for about 60%-90% of epoxy plastic sealing materials. Its performance directly determines the packaging effect, so the epoxy mentioned above plastic sealing materials need to be improved to achieve the performance of micro silica micro-powder.
There will be higher requirements for micro silica micro-powder's particle size, purity, and sphericity. The particle size distribution of micro silica micro-powder directly affects the viscosity, flying edge, fluidity, epoxy plastic sealing material content, and the impact on the device's gold wire during packaging.
The high-quality micro silica powder can reduce the overflow flying edge of epoxy plastic sealing material, and has better fluidity and higher electrical insulation. The development of micro silica powder towards spheroidization
The general micro silica powder has an irregular angular structure; although it has a low cost, it has poor fluidity and easily damages the mold in processing. Therefore, angular micro silica powder is difficult to widely use in large-scale and ultra-large-scale integrated circuits.
With the rapid development of modern microelectronic technology in the direction of high integration, high density, and miniaturization, the market demand for spherical micro silica powder in epoxy plastic sealing materials for large-scale and ultra-large-scale integrated circuits is increasing, which requires not only ultra-fine fillers in packaging materials but also high purity and low content of radioactive elements, especially for particle morphology.
Spherical micro silica powder has become an indispensable functional filling material in VLSI packaging materials because of its excellent properties, such as high heat resistance, high moisture resistance, high filling rate, low expansion, low stress, low impurity, low friction coefficient, and so on.
Benefiting from the further development and promotion of 5G applications, the copper-clad laminate market, especially the high-frequency and high-speed copper-clad laminate market, is expected to achieve rapid growth and further drive the demand for fused micro silica powder and spherical micro silica powder.
In addition, with the rapid growth of advanced packaging market demand to expand the growth space of spherical micro silica powder, the scale of micro silica powder for epoxy plastic sealing material is expected to reach 0.7 billion USD in 2025.
Micro silica powder supplier
Luoyang Tongrun is an ISO9001 registered distributor of high quality specialty raw materials used in a wide range of industries.
Luoyang Tongrun Nano Technology Co. Ltd. (TRUNNANO) is a trusted micro silica powder manufacturer supplier with over 12-year-experience. We ship our goods all over the world.
If you are looking for high-quality micro silica powder, please feel free to contact us and send an inquiry.
