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Main Application Areas of Silica Powder

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Update time : 2021-12-08 10:58:55

What is silica powder?

Silica powder is made of natural quartz ore, fused silica, etc. as raw materials, processed by multiple processes such as grinding, precision classification, and impurity removal. The main products on the market include crystalline silicon powder and fused silica. Micropowder and spherical silica micropowder, etc.

Main application areas of silica powder

Crystalline silica powder is mainly used for copper clad laminates used in air conditioners, refrigerators and other household appliances, as well as epoxy plastic packaging materials used in switches, wiring boards, etc.; fused silica powder is mainly used for copper clad laminates used in smart phones, tablet computers, air conditioners, and washing machines. Among the epoxy plastic molding compounds used; spherical silicon powder has excellent characteristics such as good fluidity, low stress, small specific surface area and high bulk density. The filling rate of spherical silicon powder is higher than that of angular silicon powder, which can significantly reduce copper clad laminates and epoxy plastic molding compounds. The coefficient of linear expansion is mainly used in high-end copper clad laminates such as aerospace, 5G communications, and epoxy plastic packaging materials for large-scale integrated circuit packaging such as smart phones and wearable devices.

Application of silica powder in Copper Clad Laminate

Adding various performance fillers to the production formula of the copper clad laminate used in the printed circuit board is an important way to improve the heat resistance and reliability of the printed circuit board. As a filler, silica powder has advantages in heat resistance, dielectric properties, linear expansion coefficient and dispersibility in resin systems, so it is widely used in the copper clad laminate industry.

Application of silica powder in Epoxy Molding Compound

The molding compound made up of epoxy resin as matrix resin, high-performance phenolic resin as curing agent, adding silicon powder as filler, and adding a variety of additives is a key material for encapsulating chips in electronic products. The filling rate accounts for 60-90% of the epoxy molding compound composition.


Luoyang Trunnano Tech Co., Ltd (TRUNNANO) is a professional silica powder supplier with over 12 years experience in chemical products research and development. We accept payment via Credit Card, T/T, West Union and Paypal. Trunnano will ship the goods to customers overseas through FedEx, DHL, by air, or by sea.


If you are looking for high quality SiO2 powder, please feel free to contact us and send an inquiry.

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