Metal Alloy High Purity Titanium Sputtering Target

About Metal Alloy High Purity Titanium Sputtering Target:
Purity is one of the main performance indicators of the target material, as the purity of the target material has a significant impact on the performance of the thin film.

The main performance requirements of the Titanium Sputtering target material:
purity
Purity is one of the main performance indicators of the target material, as the purity of the target material has a significant impact on the performance of the thin film. However, in practical applications, the purity requirements for the target material are also different. For example, with the microelectronics industry's rapid development, silicon wafers' size has increased from 6 "and 8" to 12 ", while the wiring width has decreased from 0.5um to 0.25um, 0.18um, or even 0.13um. Previously, 99.995% of the purity of the target material could meet the process requirements of 0.35umIC, while preparing 0.18um lines required 99.999% or even 99.9999% of the purity of the target material.

Impurity content
The impurities in the solid target material and the oxygen and water vapor in the pores are the main pollution sources for depositing thin films. Different target materials have different requirements for different impurity contents. For example, pure aluminum and aluminum alloy targets used in the semiconductor industry have special requirements for alkali metal content and radioactive element content.

Density
To reduce porosity in the solid target material and improve the performance of sputtered films, it is usually required that the target material have a high density. The density of the target material not only affects the sputtering rate but also affects the electrical and optical properties of the thin film. The higher the density of the target material, the better the film's performance. In addition, increasing the density and strength of the target material enables it to better withstand the thermal stress during the sputtering process. Density is also one of the key performance indicators of the target material.

Grain size and grain size distribution
Usually, the target material has a polycrystalline structure, with grain sizes ranging from micrometers to millimeters. For the same target material, the sputtering rate of targets with small grains is faster than that of targets with coarse grains. The thickness distribution of thin films deposited by target sputtering with smaller grain size differences (uniform distribution) is more uniform.

Standard:
ASTM B265, ASME SB265, ASTM F67, ASTM F136, AMS 4902, AMS 4911

Properties:
Titanium sputtering target is made of titanium metal, which is recognized for its high strength-to-weight ratio. It is a strong metal with low density that is quite ductile (especially in an oxygen-free environment), lustrous, and metallic-white in color. The relatively high melting point (more than 1,650 °C or 3,000 °F) makes it useful as a refractory metal. It is paramagnetic and has fairly low electrical and thermal conductivity.

Application:
mainly used for integrated circuit, DRAMS and flat panel display application.

Payment & Transportation: