Aluminum nitrideAlN ceramics Aluminum nitride is a refractory composite ceramic material with a hexagonal wurtzite structure. Pure aluminum nitride is blue-white, and aluminum nitride ceramics are usually gray or white. Aluminum nitride AlN is stable at high temperatures in an inert atmosphere and melts at 2800 °C. It has high thermal conductivity and good electrical insulation properties, as well as low dielectric constant and dielectric loss. This combination of properties makes it a key advanced material for many applications such as optics, lighting, electronics, and renewable energy.
Aluminum nitride structure Aluminum nitride AlN has a hexagonal crystal structure and is a covalent bonding material. Commonly used methods for preparing aluminum nitride include direct nitridation, carbothermal reduction, high-energy ball milling, high-temperature self-propagating synthesis, chemical vapor deposition and so on.
Preparation method of aluminum nitride ceramics The preparation method of aluminum nitride ceramics is basically similar to that of other ceramic materials. There are three preparation processes: powder synthesis, molding, and sintering. Aluminum nitride powder is used as the raw material to prepare the final ceramic product. Its purity, particle size, oxygen content and other impurity content have an important impact on the thermal conductivity, subsequent sintering, and forming process of the subsequent product. It is the excellent performance of the final product. cornerstone. There are several methods for the synthesis of aluminum nitride powder: direct nitridation, carbothermic reduction, self-propagating high-temperature synthesis, and chemical vapor deposition.
Molding process of aluminum nitride powder There are many molding processes for aluminum nitride powder, and traditional molding processes such as molding, hot pressing, isostatic pressing, etc. are all applicable. Due to the strong hydrophilicity of aluminum nitride powder, in order to reduce the oxidation of aluminum nitride, contact with water should be avoided as much as possible during the molding process. In addition, although hot pressing and isostatic pressing are suitable for preparing high-performance bulk aluminum nitride ceramic materials, their high cost and low production efficiency cannot meet the increasing demand for aluminum nitride ceramic substrates in the electronics industry. In order to solve this problem, in recent years, people have adopted the casting method to form aluminum nitride ceramic substrates. The tape casting method has also become the basic main forming process for aluminum nitride ceramics used in the electronics industry.
Application of Aluminum Nitride Ceramics The application of aluminum nitride ceramics is also very extensive: as a substrate material, as an electronic film material, as a coating of crucible or refractory materials, and aluminum nitride can be used as a container for vacuum evaporation and smelting of metals. The multiple excellent properties of aluminum nitride determine its many applications. As a piezoelectric film, it has been widely used; as a packaging, dielectric isolation and winding material for electronic devices and integrated circuits, it has important application prospects; as a blue light, Ultraviolet luminescent materials are also the current research hotspots; as high polymer materials, they can be used to fix molds, make adhesives, thermal greases, and heat dissipation pads. After further development of the market, the application range of aluminum nitride ceramic materials will increase. Coming more and more.
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